The ICT-Xp45-W-series is cost-efficient, electrically non-insulating and enriched with a high-heat conductive filler, solvent-and silicone-free high-performance phase change material.
The product group comprises three thickness units in total: 0,10mm, 0,20mm, 0,30mm All three products differ only by layer thickness.
Alternative replacement of thermally conductive paste - assure uniformity during assembly and increase durability of semiconductors by long-term material stability - no solvents and silicone evaporate, also suitable for applications in medical technology and optics. It is also an alternative to TIM applied to bases directly by the manufacturers - the advantage of variability, better transport and handling with modules, and there is no need to solve the expiration time of the modules prepared with TIM at the base. Only to watch storing temperature.
|Marking manufacturer||Xp45-W-30-R |
|Type of component:||Fillers |
|Type of material:||!_conductive_! |
|Material: Housing||Non-Silicone |
|Color||GY - gri 40 % |
|Case:||Lățimea benzii W |
Packaging and weight:
|Weight:||60 [g] |
|Type of packaging:||ROLL |
|Small package (Number of units):||1 |
Thermal and mechanical parameters:
|Tmin (minimum working temperature)||-40 [°C] |
|Tmax (maximum working temperature)||140 [°C] |
|Thermal conductivity||3.5 W/m*K |
|Rth Thermal Impedance||0.0076 K-in2/W |
|W - Width ||355 [mm] |
|L - Length ||1000 [mm] |
|T - thickness||0.3 [mm] |
|Dimensions of outlets||0.00 [mm] |
Alternatives and replacements
|Alternative 1:||182439 - I+W300x600-IP50-F05-AL2 (STF) |